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Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X .
We are seeking an experienced Packaging Engineer to lead the development and production implementation of advanced packaging solutions for module products. The engineer will own package development from concept, design and development through qualification and production release. This role will collaborate with product design teams, material suppliers, manufacturing partners, and outsourced semiconductor assembly and test providers to deliver reliable, manufacturable, and high-performance packaging solutions.
Key Responsibilities:
Develop packaging solutions for new module products to optimize performance, manufacturability and reliability from initial design through qualification and production release.
Develop materials, assembly processes, process control plans with material suppliers, assembly vendors during new package development (NPI).
Develop new package technologies, associated assembly processes, and design rules in collaboration with the product design engineers and the suppliers.
Develop project plans and drive the on-time delivery of package-development milestones.
Partner with design teams to define package requirements and influence package-related design decisions.
Work closely with ADI’s overseas assembly subcontractors (OSATs) for new package development and other package-related engineering activities. This role requires periodic late-afternoon or early-evening meetings with international partners, along with occasional international travel.
Provide package-related engineering support collaborating with reliability teams, business units, and supply chain management teams.
Conduct process failure mode and effects analysis (FMEA), execute design of experiments (DOE), manage process change notification (PCN).
Develop, improve and maintain package design rules and implement them into design tools and module assembly specifications.
Create and maintain package models, drawings and design documentation.
Perform package-level and system-level thermal and mechanical simulation for package design optimization and customer support.
Minimum Qualifications:
Master’s degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, Mechanical Engineering, or a related field, plus at least five years of relevant industry experience is required. Ph.D. degree is preferred.
Knowledge and experience in various package technologies, process flows, materials, chip-package interaction, qualification and manufacturing implementation.
Experience with surface-mount technology processes, package substrates, printed circuit board technologies, System-in-Package integration, wire-bond and flip-chip interconnects, passive-component integration, and flip-chip bumping.
Strong knowledge in IC package reliability standards and requirements, failure analysis techniques, assembly process failure mechanisms and root-cause analysis techniques.
Experience in selecting IC package bill of materials (BOM) supported by a solid understanding of mechanical, thermal, and electrical properties of semiconductors, metals, ceramics, and polymer composites.
Experience in creating package design models and drawings for package development, simulation, and documentation.
Working experience in manufacturing control plans, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of…