About the Role
We are seeking an experienced Senior Manager, Package & Board Team to lead the design and development of advanced IC packaging and board-level solutions. This role will drive technology strategy, technical execution, and team development to deliver high-performance, cost-effective, and reliable semiconductor products.
Key Responsibilities
Lead the Advanced Package & Board Design Team across substrate, interposer, and PCB design.
Define packaging and board technology strategies aligned with product roadmaps.
Establish design and verification methodologies for advanced packaging, including 2.5D, fan-out, and chiplet integration.
Oversee interposer, substrate, and system board design from concept through production.
Drive chiplet, HBM, and passive component integration, including package co-design with silicon teams.
Ensure signal integrity, power integrity, mechanical, thermal, and reliability requirements are met.
Manage board-level designs for system bring-up, test platforms, and reference designs.
Work with OSATs, substrate suppliers, PCB manufacturers, and EDA vendors on design flows, validation, and production readiness.
Manage project resources, schedules, and budgets while driving multiple programmes.
Build and mentor a multidisciplinary engineering team and foster cross-functional collaboration.
Key Requirements
Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field; PhD preferred.
At least 15 years of experience in IC packaging, substrate/board design, or hardware system integration.
Proven leadership experience managing multidisciplinary engineering teams and projects.
Hands-on experience with 2.5D/3D integration, chiplet-based design, and advanced packaging technologies.
Strong knowledge of signal and power integrity, mechanical and thermal analysis, and reliability validation.
Experience working with OSATs, substrate suppliers, and EDA tools such as Cadence, Mentor, or Ansys.
Understanding of design automation, DFM/DFT, and production ramp-up processes.
Strong technical, strategic, problem-solving, and communication skills.
Ability to manage multiple programmes and deliver under tight schedules.