The application window is expected to close on: 10/08/2026 Meet the Team
The Component Quality and Technology (CQT) organization is seeking a detail-oriented and proactive Semiconductor Packaging Component Quality Engineer to be our technical expert in ensuring the highest standards of component integrity. You will use your deep packaging and board-level expertise to evaluate the quality, reliability, and physical integrity of packaged semiconductor components. We are a global team dedicated to ensuring the highest quality standards. You will work alongside leaders in Quality, Reliability, Component Engineering, and Supply Chain. We pride ourselves on a culture of technical rigor, continuous improvement, and collaborative problem-solving.
What You'll Do
Component Packaging Evaluation: Assess and lead the quality and physical integrity of incoming packaged components from external suppliers.
Board-Level Reliability: Review supplier-provided data or execute BLR/L2 reliability testing to ensure component-to-board interconnect integrity for best outcomes in SMT manufacturing and long-term field use.
Failure Analysis (FA): Oversee root-cause analysis on component failures, identifying package-level defects such as delamination, wire bond lifts, die cracking, and solder joint fatigue.
Vendor Quality Management: Partner with external component suppliers and OSATs to audit packaging processes, review manufacturing reliability data, and resolve package-level reliability excursions.
Change Assessment: Evaluate supplier-driven package process changes (PCNs) and determine alignment with internal quality standards.
Minimum Qualifications
Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
4+ years of experience in semiconductor quality, packaging reliability, or board-level failure analysis.
Strong understanding of standard IC packaging types (e.g., BGA, QFN, WLCSP, Flip-Chip) and their associated material, mechanical, and thermal stress behaviors.
Strong working knowledge of JEDEC and IPC standards regarding packaging, reliability testing, and board-level qualifications.
Preferred Qualifications
Direct experience designing, setting up, and executing Level 2 (L2) / Board Level Reliability (BLR) testing pipelines, including thermal cycling, mechanical shock/drop testing, board flex testing, and continuous daisy-chain resistance monitoring.
Proficiency with reliability software (e.g. Reliasoft, Weibull++, Minitab or JMP) and CAD/PCB layout viewers (e.g. Allegro, Altium)
Familiarity with PCB board design principles, footprint layout constraints, and schematic routing that impact package solder joint reliability.
Formal training in structured problem-solving methodologies (e.g., 8D, 5-Why, Fishbone analysis, Six Sigma Green/Black Belt).
Pourquoi Cisco?
Chez Cisco, nous révolutionnons la façon dont les données et les infrastructures se connectent et protègent les entreprises à l’ère de l’intelligence artificielle et au-delà. Nous innovons sans crainte de manquer quelque chose depuis 40 ans pour créer des solutions qui optimisent la collaboration entre les humains et la technologie dans les mondes physiques et numériques. Ces solutions offrent aux clients une sécurité, une visibilité et des analyses inégalées sur l’ensemble de l’empreinte numérique.
Alimentés par la profondeur et l’étendue de notre technologie, nous expérimenterons et créons des solutions significatives. Ajoutez à cela notre réseau mondial de personnes fonceuses et d’experts, et vous verrez que les possibilités de grandir et de bâtir sont illimitées. Nous travaillons en équipe, en collaborant avec empathie pour réaliser de très grandes choses à l'échelle mondiale. Parce que nos solutions sont partout, notre impact est partout.
Nous sommes Cisco, et notre puissance commence avec vous.
Message aux candidats qui veulent travailler aux États-Unis ou au Canada :
L’échelle salariale de départ pour ce poste s’établit à (voir la…