- Where
- New Cairo City, Cairo Governorate, Egypt
- Level
- Mid
Envision Employment Solutions is currently looking for a Physical Design SiP Architect for one of our partners, an IT Services and IT Consulting company.
THE ROLE
As chiplets and system in package designs take over, the architecture no longer stops at the die edge. You'll define the physical architecture of SiP solutions, bringing dies, packaging, power, thermal and signal integrity together into one design that works as a system.
WHAT YOU'LL DO
Define and document the physical architecture for system in package and chiplet based designs
Lead architecture decisions on partitioning, die to die interfaces and package integration
Drive power analysis, power integrity, thermal analysis and EMI considerations at package and system level
Guide place and route and physical implementation strategy across dies
Use system modelling (such as SystemC) to evaluate architecture options, including RISC based subsystems
Write and own architecture definition documents
Work across design, packaging and system teams to close on performance, power and cost
WHAT WE'RE LOOKING FOR
10+ years of experience in physical design and/or SoC architecture
Hands on experience with SiP, chiplet or advanced packaging projects
Strong understanding of power integrity, thermal analysis and EMI
Solid place and route and physical design background
Experience with SystemC modelling and RISC based architectures
Strong architecture documentation skills
Ability to lead technical decisions across multiple teams
YOU'LL THRIVE HERE IF YOU
You think about the whole package, not just the die
You enjoy weighing power, thermal and signal trade offs together
You write architecture documents that people actually follow
You're excited about where chiplet technology is heading
You can bring design and packaging teams to one decision