About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visitwww.gf.com.
Summary of Role: The CMOS product team is seeking a Singapore-based Senior Advanced Packaging 3DHi and2.5D Integration Lead to join GlobalFoundries’ local technology development organization. Based at our Singapore site, this lead integrator will define and drive advanced packaging technology development from architecture and early process demonstration through qualification, manufacturing transfer, and production readiness. The successful candidate will bring deep, hands-on expertise in 3D heterogeneous integration (3DHi) and 2.5D solutions, including chiplet integration, silicon interposers and bridges, through-silicon vias(TSVs), die-to-wafer and wafer-to-wafer bonding, hybrid bonding, redistribution layers, and package-level integration. The role requires ownership of integration architecture, test-site and qualification-vehicle definition, module and process-flow alignment, and electrical, thermal, mechanical, reliability, yield, and manufacturability validation. The candidate will collaborate closely with engineering, manufacturing, reliability, test, supply-chain, and business teams in Singapore, while coordinating with GlobalFoundries’ sites and partners worldwide to deliver critical technology milestones for customer product requirements and the company’s advanced packaging strategy.
Essential Responsibilities:
• Serve as the lead integrator for complex 3DHi and 2.5D technology development programs, translating customer product requirements into integration architectures, qualification strategies, and executable technology roadmaps.
• Define and integrate end-to-end process flows for chiplet-based 2.5D and 3DHi solutions, including silicon interposers or bridges, TSVs, redistribution layers, wafer thinning and handling, micro-bump or hybrid-bond interfaces, die-to-wafer and wafer-to-wafer assembly, and package integration.
• Own integration trade-off analysis across electrical performance, power delivery, signal integrity, thermal management, mechanical stress, warpage, reliability, yield, cost, and manufacturability.
• Define test-site requirements and lead development of test structures, interposer and package vehicles, daisy chains, reliability structures, and electrical test methodologies needed to validate module and system-level performance.
• Establish process-control, in line inspection, metrology, defectivity, known-good-die, assembly, and qualification strategies that enable robust technology development and high-volume manufacturing readiness.
• Identify integration gaps and failure mechanisms; develop structured DOEs and data-driven problem-solving plans to determine root cause, optimize process windows, and accelerate technology maturity.
• Analyze electrical, physical, thermal, mechanical, defectivity, reliability, and yield data to identify trends, define corrective actions, and enable rapid technical decisions.
• Lead cross-functional execution through concept definition, architecture and design-rule alignment, DOE planning, milestone reviews, qualification readiness, process freeze, supply-chain alignment, and manufacturing transfer.
• Provide technical leadership and clearly communicate program status, risks, trade-offs, and recommendations to management, customers, ecosystem partners, and global engineering teams.
• Build strong working relationships across the Singapore organization and GlobalFoundries’ world wide technology development, manufacturing, reliability, test, design enablement,…