About GlobalFoundries
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity, and sustainability. For more information, visit www.gf.com .
Introduction
We are seeking an experienced and highly motivated SMTS Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies. The ideal candidate will have extensive knowledge and hands-on experience in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes. This position offers a unique opportunity to work on cutting-edge packaging solutions that will drive the next generation of semiconductor devices.
Responsibilities:
Lead Integration Activities: Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams.
Technical Expertise: Provide technical guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment. Stay current with industry trends and advancements.
Project Management: Develop and maintain project plans, timelines, and budgets. Coordinate with cross-functional teams to ensure project milestones are met.
Process Development: Drive the development and optimization of 2.5D and 3D heterogeneous integration processes, including interposer design, through-silicon vias (TSVs), die stacking, and thermal management.
Quality Assurance: Implement and monitor quality control measures to ensure the highest standards of product reliability and performance.
Collaboration: Work closely with R&D, design, and manufacturing teams to integrate new 2.5D and 3D packaging solutions into production. Foster a collaborative and innovative environment.
Documentation: Prepare and maintain detailed technical documentation, including process flow diagrams, work instructions, and validation reports.
Problem Solving: Identify and resolve technical challenges related to 2.5D and 3D packaging integration. Implement corrective actions and continuous improvement initiatives.
Training and Mentorship: Mentor junior engineers and technicians, providing guidance and support in their professional development.
Compliance: Ensure all packaging processes comply with industry standards and regulatory requirements.
Qualifications
Education: Bachelor’s or master’s degree in electrical engineering, Materials Science, Mechanical Engineering, or a related field.
Experience: Minimum of 10 years of experience in semiconductor packaging, with at least 5 years in a leadership role, specifically in 2.5D and 3D heterogeneous integration technologies.
Technical Skills: In-depth knowledge of 2.5D and 3D heterogeneous integration technologies, including interposer design, TSVs, die stacking, and system-in-package (SiP).
Project Management: Proven track record of managing complex projects with cross-functional teams.
Problem Solving: Strong analytical and problem-solving skills. Ability to troubleshoot and resolve technical issues efficiently.
Communication: Excellent verbal and written communication skills. Ability to convey technical information clearly and concisely.
Team Player: Demonstrated ability to work collaboratively in a team environment. Strong leadership and mentorship skills.
Innovation: Passion for innovation and continuous improvement. Ability to drive new ideas and technologies forward.
Quality Focus: Commitment to maintaining high-quality standards in all aspects of the job.
Adaptability: Ability to adapt…