About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .
Introduction:
GlobalFoundries Singapore is seeking a highly skilled and motivated Senior Member of Technical Staff (SMTS), Process Engineering, to join our new 300mm Advanced Packaging Center in Singapore.
In this role, you will be responsible for developing, optimizing, and qualifying advanced packaging processes, including Bond/Debond, Plasma, UV, Cleaning, Die Reconstitution, Annealing, and Through-Silicon Via (TSV) technologies for multi-stack wafer bonding and Die-to-Wafer integration at both wafer and frame-form-carrier levels. You will drive process development, troubleshoot process and equipment-related issues, support tool installation and qualification, and lead the transfer of robust manufacturing-ready processes into production. As a key technical owner, you will oversee both process performance and equipment sustainability to ensure successful high-volume manufacturing.
Job Responsibilities:
Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. process stability, cost of ownership) targets.
Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance and tool matching. Understand the concept of repeatability and reproducibility (R&R) run.
Improve process robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.
To work closely with equipment team to improve equipment productivity indices
Resolve complex technical issues in own Module or yield related issues.
Support the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.
Sustain and improve process / SPC to meet quality, cost, productivity requirements
To coach and develop other engineers on advance packaging Etch processes knowledge.
Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Related manufacturing and development experience is requested.
Required Qualifications:
BS degree or Master's Degree or PhD in Electrical Engineering, Material Science & Engineering, Chemical Engineering, Physics, or other relevant engineering discipline is required
7 years of relevant advanced packaging process related process
Required experience of Leading Fab wide cross modules process development projects coordination
Relevant working experience in advanced packaging (Si interposer, D2W, W2W) process tools.
Excellent verbal and written communication skills.
Strong interpersonal skills and ability to work effectively with different cultures.
Conduct regular meetings with PI & UMD for knowledge learning, with yearly projects that improve quality, cost, yield, or productivity. Cost reduction
Take charge of group development and needs
GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
As an affirmative employer, all qualified applicants are considered…