As a Module Development Engineer, you will spearhead the development and optimization of advanced semiconductor manufacturing processes crucial to delivering Intel's high-performance devices. In this role, you will design experiments, analyze data, and refine process methodologies, ensuring seamless integration and manufacturability. Your work will directly contribute to Intel's leadership in creating cutting-edge device architectures and advancing the semiconductor industry forward.

Business Group:

Intel Foundry Technology Development is dedicated to delivering world-class manufacturing solutions that power Intel's product innovation. The team focuses on advancing semiconductor process engineering and enabling the design and production of industry-leading devices. Joining this organization means collaborating in a dynamic environment that supports Intel's continued leadership in the competitive semiconductor market.

Key Responsibilities:

Design, execute, and analyze experiments to optimize manufacturing processes for yield, functionality, and efficiency

Develop and sustain semiconductor processing techniques, including material selection, equipment optimization, and metrology system design

Conduct feasibility studies and pathfinding activities to identify innovative solutions for next-generation device architectures

Collaborate with equipment and material suppliers to evaluate, qualify, and integrate novel technology solutions into manufacturing workflows

Perform process characterization using Statistical Process Control (SPC), Design of Experiments (DOE), and advanced data analysis tools

Partner with cross-functional teams to ensure seamless process integration and manufacturability

Support technology transfer to high-volume manufacturing through training, audits, and process consistency across sites

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

PhD in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, Chemistry, or related STEM field

6+ months of experience in one or more of the following:

Proficiency in semiconductor manufacturing techniques such as lithography, etching, thin film deposition, or planarization

Expertise in process characterization methods and statistical analysis tools like MATLAB, JMP, or Python

Familiarity with materials characterization techniques such as SEM, TEM, XPS, or ellipsometry

Preferred Qualifications:

Experience with advanced device architectures and process integration challenges, such as transistor scaling or selectivity control

Hands-on experience with equipment troubleshooting, maintenance, or development alongside suppliers

Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD

Strong problem-solving skills and the ability to manage multiple tasks in a fast-paced environment

Collaborative mindset with a proven track record of working across interdisciplinary teams to achieve shared objectives

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any…