Job Details:
Job Description:
The Role and Impact
Note: This position requires regular onsite presence to perform essential job responsibilities.
New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will support both high-volume manufacturing (HVM) and technology development activities, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies.
Key Responsibilities
Responsibilities include, but are not limited to:
Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency.
Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance.
Develop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones.
Install, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones.
Lead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence.
Support and sustain development and pilot production lines during early test vehicle and production phases.
Partner closely with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.
Evaluate, qualify, and implement new hardware, software, and equipment upgrades.
Lead critical task forces and cross-functional initiatives related to areas of ownership and adjacent manufacturing processes.
Desired Behavioral Traits
The successful candidate will demonstrate:
A strong commitment to safety and a proactive approach to promoting a safe work environment.
The ability to thrive in a dynamic environment with evolving priorities and technical challenges.
A results-oriented mindset with strong organizational skills, initiative, resourcefulness, and accountability.
Excellent analytical and problem-solving skills, with a strong sense of urgency and commitment to achieving business objectives.
The ability to distill complex technical concepts into clear, actionable communication for stakeholders at all organizational levels.
Proven success working within high-performing teams, including demonstrated leadership, collaboration, prioritization, and problem-solving capabilities.
A continuous improvement mindset, with experience applying Lean principles and methodologies to drive operational and manufacturing excellence.
Qualifications:
Minimum Qualifications
Bachelor's degree in a STEM or related engineering discipline with 4+ years of relevant semiconductor industry experience; or
Master's degree in a STEM or related engineering discipline with 3+ years of relevant semiconductor industry experience; or
PhD in a STEM or related engineering discipline with relevant academic or research experience in semiconductor technologies, electronics, mechanical engineering, manufacturing processes, or closely related fields.
Relevant experience may include:
Semiconductor processing and manufacturing
Process characterization and optimization
Manufacturing process control methodologies
Continuous process improvement initiatives
Equipment maintenance and troubleshooting
Design of Experiments (DOE) and data-driven problem solving
Applicable experience may be obtained through a combination of the areas listed above and does not need to be accumulated separately within each discipline.
For candidates qualifying through the PhD pathway, relevant academic research, laboratory work, publications, or dissertation projects may be considered in lieu of additional full-time industry experience.
Preferred…