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The Vice President of Product Engineering is the senior leader accountable for product engineering strategy, execution, and organizational performance across multiple wafer fabrication sites producing indium phosphide (InP)-based optoelectronic devices. This role will report to the EVP of Global Fabs and be responsible for building and leading a high-performing, data-driven product engineering organization that translates customer and business requirements into stable, scalable, high-yielding, and reliable manufacturing solutions.
The VP will partner closely with wafer-fab operations, process engineering, device design, epitaxy, test, reliability, quality, supply chain, packaging, sales, and program management. The successful candidate will establish common methods and priorities across fabs while ensuring each product is supported through development, qualification, production ramp, sustaining, cost reduction, and end-of-life management.
Key Responsibilities
Product Engineering Leadership
Own the global product engineering strategy, operating model, staffing plan, technical roadmap, and budget for multiple InP wafer fabs.
Lead, develop, and retain product engineering leaders and technical teams responsible for new product introduction, production ramp, sustaining engineering, yield improvement, test strategy, product characterization, and cost reduction.
Define clear product ownership, decision rights, escalation paths, and performance expectations across sites.
Create a culture of technical rigor, accountability, rapid problem solving, cross-functional collaboration, and continuous improvement.
New Product Introduction and Manufacturing Readiness
Lead the transfer of new InP-based optoelectronic products from design and development into qualified, repeatable, high-volume manufacturing.
Establish product release criteria, manufacturing readiness reviews, qualification plans, control plans, test limits, data requirements, and production ramp plans.
Ensure robust design-for-manufacturability, design-for-test, and design-for-reliability practices are incorporated early in the product lifecycle.
Coordinate product and process transfers between fabs, ensuring equivalency, documentation, change control, risk management, and customer requirements are addressed.
Yield, Performance, Reliability, and Cost
Own product yield, electrical and optical performance, test yield, outgoing quality, product reliability, and cost improvement roadmaps.
Drive structured problem solving using statistical process control, design of experiments, fault isolation, root-cause analysis, failure analysis, and corrective and preventive action methods.
Lead cross-functional improvement programs addressing wafer-level variation, device performance, defectivity, parametric yield, test coverage, reliability margins, and product cost.
Establish methods to correlate epitaxy, wafer fabrication, wafer-level test, die-level test, packaging, final test, and field performance data.
Ensure product specifications, guard bands, screening methods, and test limits are technically justified and aligned with customer and reliability requirements.
Multi-Fab Governance and Operational Excellence
Standardize product engineering processes, metrics, data systems, documentation, and technical reviews across manufacturing sites while accounting for site-specific capabilities.
Chair regular product performance, yield, quality, reliability, and manufacturing readiness reviews with fab and functional leaders.
Develop capacity and resource plans aligned with product demand, technology roadmaps, fab capabilities, and business priorities.
Partner with operations and process engineering to resolve constraints, improve cycle time,…