About Marvell
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Group Description
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance‑driven systems.
Within this ecosystem, Marvell’s central advanced packaging organization plays a critical role in delivering next‑generation connectivity and compute products. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced IC packages that support high‑speed interfaces. This work directly shapes product performance, reliability, and time‑to‑market, making it a key contributor to Marvell’s overall technology leadership.
What You Can Expect
Marvell's Central Engineering team is seeking a highly motivated High-Speed IC Package Development Engineer to develop advanced microelectronic packaging solutions for next-generation semiconductor products supporting 448 Gb/s data rates and beyond.
In this role, the engineer will lead package development and electrical design activities, including floorplanning, netlist creation, and BGA map definition, while optimizing signal integrity, power integrity, performance, manufacturability, reliability, and cost.
The engineer will work closely with package operations teams to evaluate package technologies, drive layout implementation, and ensure designs meet product and manufacturing requirements. Partnering with marketing, system architects, and IC design teams, the engineer will define package requirements, develop achievable specifications, and contribute to the advancement of next-generation packaging technologies.
What We're Looking For
At least a Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 7+ years of related professional experience OR a Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5+ years of experience.
Experience with high-speed electronic packaging for digital and analog ICs, package floor planning, netlist, schematic and BGA map development.
Experience with 2.5D/3D package development.
Knowledge of packaging technologies, materials, package substrate design rules and assembly rules
Ability to manage package design and development involving various cross functional teams like IC physical layout teams, Analog and Digital designers, SI/PI teams, thermal-mechanical teams, assembly development, and marketing.
Experience with CPC/CPO connectors is highly desired.
Basic proficiency with IC package floor planning tools like integrated system planner (ISP) and layout tools like APD
Strong fundamentals in EM, transmission lines and microwave theory and e xperience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity is highly desired
Power plane design, modeling and analysis using tools like PowerSI, SIwave is highly desired
Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
Track record of new product introduction from concept, through development and production is a plus.
A team player
Strong communication, presentation, and documentation skills
Expected Base Pay Range (USD)
141,150 - 211,400, $ per annum
The successful candidate’s starting base pay will be determined based on…