About Marvell
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
The package engineering team drives semiconductor package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design that results in the delivery of engineering samples and a subsequent production ramp-up. There is the excitement of always working on new projects and cutting-edge technologies.
What You Can Expect
The Manager will be responsible for managing the team that is involved in IC packaging layout for high speed 2D and 2.5D packages across multiple product lines. The manager will develop the team to do IC package layout considering manufacturing and assembly tolerances.
What We're Looking For
Bachelor’s degree in computer science, Electrical Engineering or related fields and 8+ years of related professional experience.
Master’s degree and/or PhD in Computer Science, Electrical Engineering, or related fields with 8-10 years of experience.
Experience managing high-performance technical teams
Strong expertise with IC package layout tools, such as Cadence APD or Mentor XPD
Ability to manage resources for IC package layouts across multiple product lines
Experience with 2.5D package design for IC packaging technologies such as CoWOS
Experience with IC package layout for high-speed SerDes interfaces, such as 224 Gbps
Experience with IC package layout for die-to-die and HBM interfaces in 2D and 2.5D RDL interposers
Proven track record of new product introduction, from concept through development and production
Understanding of IC package design requirements for high-speed interfaces, including setting up the constraint manager
Ability to automate layout tasks using scripting and AI methodologies
Strong understanding of the Design for Manufacturing (DFM) process
Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules
Experience with power plane design and translating power supply requirements into design
Experience working with external IC package layout vendors
Ability to look after the well-being of the team and ensure it performs efficiently
Strong communication, presentation, and documentation skills
Expected Base Pay Range (USD)
149,340 - 223,700, $ per annum
The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
This role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success.
Additional Compensation and Benefit Elements
Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and…