About Marvell
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Group Description
The Advanced Packaging Technology Development team develops and qualifies advanced packaging technologies and package architectures that enable Marvell's next-generation AI, cloud, networking, silicon photonics, and co-packaged optics products. Working across product engineering, package architecture, reliability, manufacturing, customers, suppliers, and OSAT partners, the organization drives technology development, qualification, and readiness to enable strategic customer engagements and execute Marvell's long-term product and technology roadmap.
What You Can Expect
Job Responsibilities
Lead development of thermal and thermo-mechanical technologies for advanced semiconductor packaging platforms.
Define thermal architecture requirements and technology strategies supporting future AI, networking, silicon photonics, and co-packaged optics products.
Develop and evaluate advanced cooling solutions including TIMs, vapor chambers, liquid cooling, package-integrated cooling, and emerging thermal technologies.
Perform thermal, structural, and thermo-mechanical analysis and establish simulation methodologies for advanced package development.
Correlate simulation models with laboratory measurements, package characterization data, and reliability results to improve design accuracy and predictive capability.
Investigate thermal and mechanical failure mechanisms including warpage, stress, deformation, delamination, fatigue, and material degradation.
Work closely with package architects, product engineers, reliability teams, customers, suppliers, and OSAT partners to develop and qualify new technologies.
Drive technology selection, design tradeoff analysis, and technical decision-making across multiple product programs.
Mentor engineers and contribute to the development of thermal design practices, simulation workflows, and engineering standards.
Represent Marvell in technical engagements with customers, suppliers, industry consortia, and external partners as needed.
What We're Looking For
Requirements
M.S. or Ph.D. in Mechanical Engineering, Materials Science, Engineering Mechanics, or a related engineering discipline.
10+ years of thermal, thermo-mechanical, advanced packaging, or semiconductor technology development experience.
Demonstrated leadership developing thermal and thermo-mechanical solutions for advanced semiconductor packages and heterogeneous integration platforms.
Deep understanding of heat transfer, structural mechanics, material behavior, package reliability, and failure mechanisms.
Experience with advanced cooling technologies including TIMs, vapor chambers, liquid cooling, cold plates, immersion cooling, or package-integrated cooling solutions.
Extensive experience with thermal and thermo-mechanical simulation tools such as ANSYS Mechanical, Icepak, Fluent, Abaqus, COMSOL, or equivalent platforms.
Proven experience correlating simulations with laboratory measurements, package characterization, and reliability data.
Experience driving technology development with OSATs, material suppliers, cooling vendors, and cross-functional engineering teams.
Strong written and verbal communication skills with the ability to influence technical decisions across engineering organizations.
Preferred Qualifications
Development experience supporting AI accelerators, networking products, silicon photonics, co-packaged optics, or other high-performance…