Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Staff Engineer in APTD Micron you will be responsible for leading and managing the activities and operation of Advanced Package Development by collaborating with internal and external stakeholders to build and execute technology development strategies aligned to organizational and business objectives by providing high performing and cost effective packaging solution on time with best predictable reliability performance. You will need to comprehend package technology development business process (MOR development) and TECHNODE business process for packaging technology and ensure all package development and product transfer work are carried out in accordance with these business processes. Other responsibilities include ensuring organizational compliance to company policies and regulations, as well as to departmental procedures, and providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects, as well as mentoring other functional leaders through collaboration and the development of sustainably successful solutions.
Responsibilities and Duties include, but not limited to:
Develop and Communicate Technology Development Strategy
Develop and communicate Technology Development strategic objectives
Understand the impact and implications of TD strategy to the overall company strategy and direction
Technical Leadership
Set strategic and long-term technical objectives and insure they are aligned with department objectives
Demonstrate understanding of technology complexity and effective technology decision making
Provide technical leadership that may influence company direction
Cross Functional Leadership
Represent Assembly team in providing cross team/department leadership in area of responsibility
Work effectively with peers in other team/department to develop and drive cross functional initiatives
Impact and Execution
Apply knowledge to achieve quality improvements, cost control, and production efficiency
Ensure accuracy, quality, and timeliness of results
Guide best utilization of resources to achieve end results
Ensure critical deliverables, milestones and goals are met by the team
Provide input to achieve organization objectives and align group to support department objectives.
Make decisions that directly impact the achievement of work unit and sub-function objectives
Leadership Development
Mentor, develop and motivate leaders
Growth Mindset
Continue to build new skills through development goals and learning events.
Seek out opportunities to work cross functionally, build a network, and gain competency across domains
Qualifications and Skills include, but not limited to:
At least 8 years experience in packaging industry which should include at least 3years in advanced package field.
Degree/Major: MS or Ph.D in Electrical, Computer Engineering, Chemistry, Physic, Material or related field
Proven ability to lead technology development toward to industrial level achievement
Deep knowledge advanced package process development. (WSS, dicing, stacking, molding, inspection, measurement..etc)
Deep understanding of advance package architecture (2.5D, 3DIC, FO, hybrid bond...etc)
Excellent data extraction, analysis and reporting skills. (system data mining, JMP…etc)
Understanding of probe, parametric, backend and reliability testing.
In-depth understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
Strong understanding of electronic materials, processing, physical, chemical, and electrical properties, failure analysis, and characterization techniques.
Excellent…