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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Advanced Packaging Technology Development (APTD) team is developing the packaging and integration technologies that will power future generations of memory products. We bring together engineers, scientists, and innovators who thrive on solving complex technical challenges and turning breakthrough ideas into scalable manufacturing solutions. Working across device engineering, package design, reliability, and manufacturing, we help shape the future of High Bandwidth Memory (HBM) and advanced memory technologies.
Position Overview:
As a Process Integration Engineer, you will play a key role in developing and integrating advanced semiconductor process flows that enable next-generation memory solutions. This position offers the opportunity to lead challenging technical programs, solve complex integration issues, and influence technology decisions from concept through manufacturing transfer. You will work closely with cross-functional teams, use data-driven approaches to guide decisions, and help deliver innovative technologies that balance performance, yield, reliability, manufacturability, and cost.
Responsibilities:
Lead process integration projects supporting new technology development programs
Partner with process development, device engineering, package design, product engineering, reliability, and manufacturing teams to solve integration challenges
Use AI-enabled tools, statistical analysis, and engineering data to accelerate problem solving and decision-making
Design, implement, and analyze experiments to improve process performance, yield, variability, and reliability
Identify yield limiters and root causes through analysis of metrology, defect, parametric, probe, reliability, and test data
Drive corrective actions from root cause identification through implementation and validation
Develop and improve integration flows that balance performance, manufacturability, quality, reliability, cost, and schedule requirements
Support technology qualification, manufacturing transfer, and development activities across multiple sites
Minimum Qualifications:
Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field with 4+ years of semiconductor industry experience; OR Master’s degree with 2+ years of semiconductor experience; OR PhD in a related field
Experience in process integration, process development, or device development, including experiment design, execution, and analysis
Knowledge of semiconductor process integration and memory technologies such as DRAM, NAND, or emerging memory architectures
Experience using JMP or similar statistical analysis tools to drive engineering decisions
Demonstrated ability to solve complex technical problems using data-driven methods, statistical analysis, DoE, and root-cause investigation
Preferred Qualifications:
Experience with advanced packaging technologies such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, TSV, bonding, or chiplet integration
Experience supporting technology development, qualification, and transfer into high-volume manufacturing
Experience using yield, reliability, electrical, or process data to identify challenges and guide technical decisions
Experience developing statistical models, correlation studies, and yield analyses to drive process improvements
Experience applying AI or machine learning tools to engineering workflows, analytics, and yield improvement initiatives
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