Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Key Responsibilities
SSD Hardware Architecture and Development
Lead end-to-end SSD hardware architecture, design, validation and productization.
Own schematic design, component selection, PCB stack-up, placement, routing and design reviews.
Define hardware requirements covering performance, power, thermal, reliability, form factor and manufacturability.
Drive high-speed interface design and validation for PCIe, NVMe, ONFI, NAND and other relevant interfaces .
Lead controller, NAND, DRAM, PMIC, clock, power-delivery and peripheral device integration.
Develop hardware solutions for standard form factors, including M.2 and BGA , as well as customer-specific automotive and embedded form factors.
Champion an AI-first engineering mindset across SSD hardware design, validation, debug, and product execution.
Apply AI-assisted engineering tools to accelerate schematic reviews, component/BOM analysis, design-rule and DFM checks, requirements analysis, technical documentation, and engineering data analysis.
Develop and deploy Python-based automation and AI-assisted workflows for repetitive hardware engineering tasks, including test-data processing, log analysis, validation reporting, failure triage, and design checks.
Leverage Generative AI and agentic workflows to capture engineering knowledge, lessons learned, design guidelines, failure history, and reusable debug methodologies.
Automotive Hardware Requirements
Exposure to ASIL standards.
Translate customer and system-level automotive requirements into hardware design and validation specifications.
Design for extended automotive operating temperatures, typically including −40°C to +85°C or +105°C , depending on the product and application requirements.
Ensure the design meets applicable automotive reliability expectations for: Temperature cycling and thermal shock High-temperature operating life Mechanical shock and vibration Humidity and moisture resistance Board-level solder-joint reliability Power cycling and extended mission-profile operation
Support component qualification and product-level assessments aligned with applicable AEC-Q100, AEC-Q104 and AEC-Q200 expectations.
Apply appropriate design margins and derating guidelines for voltage, current, temperature and component lifetime.
Address automotive power-transient, brownout, reset, power-loss protection and startup/shutdown sequencing requirements.
Evaluate system-level EMC and ESD risks and support compliance testing against applicable automotive customer and regional requirements.
Support requirements related to long product lifecycles, component traceability, controlled BOMs, PCN management and obsolescence planning .
Functional Safety and System Robustness
Collaborate with systems, firmware and functional-safety teams to support product development aligned with ISO 26262 .
Contribute to hardware safety analysis, including: Hardware Failure Mode and Effects Analysis FMEDA inputs Diagnostic coverage assessment Single-point and latent-fault evaluation Safety mechanism definition and validation
Familiarity with Automotive SPICE development and traceability expectations is preferred.
SI/PI, Thermal and Mechanical Engineering
Own signal-integrity and power-integrity analysis for high-speed interfaces, NAND channels, clocks and critical power rails.
Correlate pre-layout and post-layout simulations with laboratory measurements.
Optimize PCB stack-up, impedance control, return paths, via structures, power distribution and decoupling.
Partner with mechanical and thermal teams to evaluate heat spreading, thermal-interface materials, airflow, enclosure constraints and junction-temperature margins.
AI & Engineering Automation
Demonstrated…