About Samsung Austin Semiconductor
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Position Summary
The Chemical Vapor Deposition (CVD) / Thin Films department at the Samsung semiconductor fabrication facility in Taylor, TX is looking for a process engineering manager to head the process engineering sub team. Candidates should be highly motivated, self-directed, technically proficient, and have a strong safety & quality mindset.
Role and Responsibilities
Here’s What You’ll Be Responsible For:
Strategic Leadership & Organizational Alignment:
Srategic Translation: Convert high-level site and departmental objectives into a cohesive operational roadmap for Process TRs to execute.
Resource Optimization: Manage the allocation of manpower and technical resources across your teams to ensure key deliverables are met.
Cross-Functional Synergy: Drive high-level collaboration between Process Engineering, Equipment Engineering, and Process Operations to eliminate bottlenecks and reduce tool downtime.
Governance: Establish and maintain standardized protocols for 8D, ALPS, and PCCB processes to ensure consistency across all process pods.
Management of Leaders:
Leadership Coaching: Mentor Process TRs on how to effectively manage their individual contributors, focusing on goal setting, talent development, and performance management.
Performance Architecture: Oversee the annual performance management cycle for the entire process organization, ensuring fair and rigorous evaluation standards are applied by the TRs.
Culture Stewardship: Foster a "learning-first," high-performance culture across both teams, ensuring that knowledge is shared between the two pods to prevent single-point-of-failure risks.
Conflict Resolution: Act as the final escalation point for technical or interpersonal disputes within the process teams.
Technical Governance & Risk Management :
High-Level Technical Oversight: Provide executive-level guidance on semiconductor processes and integration for 2nm, ensuring technical decisions are sound and sustainable.
Risk Mitigation: Oversee the management of abnormalities and deviations; ensure that the TRs are balancing quality guarantees with production and cost objectives.
Systems Stewardship: Ensure the optimal utilization of Process systems (eSPEC, PEMS, APC, RMS, YMS) and drive the adoption of new tool-set capabilities.
Safety & Compliance: Hold TRs accountable for strict adherence to site-wide safety standards and the achievement of LSM (Loss Safety Management) goals.
Operational Excellence & Site Readiness:
Mass Production Readiness: Oversee the timeline for new tool process qualification, ensuring that both teams are hitting milestones required for 2nm readiness.
CIP Strategy: Drive the overarching Continuous Improvement Process (CIP) for Operations interlocks, holds, and patient lot processes.
Executive Communication: Synthesize complex technical data from the TRs into concise reports and presentations for site leadership.
Skills and Qualifications
Here's what you'll need:
Technical Expertise: Deep expertise in 2nm semiconductor process engineering and integration.
Leadership Experience: Proven experience managing other managers or leading large, multi-tiered engineering teams in a high-volume manufacturing (HVM) environment.
Systems Knowledge: Expert-level understanding of eSPEC, PEMS, APC, RMS, and YMS.
Methodology: Mastery of 8D, ALPS, PCCB, TMCB, and RACB process frameworks.
Communication: Ability to navigate complex organizational hierarchies and communicate technical risks to non-technical executives.
The current base salary range for this role is between $147,000 - $200,500. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total…